ESP8266 D1 mini V3 layout
3D model · STEP · 977 KB
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Source: Innerscene - original model
Description
ESP8266 D1 mini V3 layout, modeled from published dimensions. Overall 25.6 x 35.2 x 13.4 mm. Key dimensions: header pitch 2.5 mm; header first y 6.9 mm; pins 16. Original reconstructed layout. ESP32 board envelope and header grid follow Espressif drawing; RF module is 18 x 25.5 x 3.1 mm. Antenna keepout is not exported as a physical part. Connector and small component detail is representative. D1 mini board envelope follows WEMOS 34.2 x 25.6 mm specification. Its 22.86 mm header-row spacing, centered 2.54 mm grid and component heights are explicit nominal library choices, not dimensioned in that source. No electrical/RF simulation or guaranteed connector fit. Exact solid STEP geometry in millimeters, opens in any CAD system. Export to STL, OBJ, GLB and other formats from the viewer. Nominal dimensions for layout, fit checks and visualization; they do not establish a manufacturing tolerance class, load rating or standards certification. Original Innerscene model, released CC0.
File: esp8266-d1-mini-v3.step · added 2026-10-05 · available until 2031-10-05. Added from Innerscene - original model under its CC0 dedication; see the library terms. Think this part infringes someone’s rights? Use Report on the viewer page or see our copyright policy.