830-point solderless breadboard
3D model · STEP · 13.1 MB
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Source: Innerscene - original model
Description
830-point solderless breadboard, modeled from published dimensions. Overall 165.1 x 54.6 x 8.5 mm. Key dimensions: hole pitch 2.5 mm; terminal points 630; power points 200; socket 1.1 mm. 830-point arrangement and nominal 165.1 x 54.6 x 8.5 mm body follow BusBoard BB830 reference. Original housing and square socket reconstruction, 2.54 mm grid. Tabs, printed numbering, hidden contact bars and contact springs are omitted. No electrical rating is transferred to this model. Exact solid STEP geometry in millimeters, opens in any CAD system. Export to STL, OBJ, GLB and other formats from the viewer. Nominal dimensions for layout, fit checks and visualization; they do not establish a manufacturing tolerance class, load rating or standards certification. Original Innerscene model, released CC0.
File: breadboard-830.step · added 2026-10-05 · available until 2030-10-05. Added from Innerscene - original model under its CC0 dedication; see the library terms. Think this part infringes someone’s rights? Use Report on the viewer page or see our copyright policy.